Encapsulation
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PDM have developed a range of techniques
to service a growing need to encapsulate PCBs and other assemblies for mechanical
protection and prevent moisture ingress.
Products can be encapsulated under vacuum or pressure, open cast or moulded
in custom designed tooling to suit the application.
PDM work closely with clients to establish the best encapsulation method,
material and tooling design required for an efficient potting operation.
PDM can formulate materials to suit individual requirements.
Encapsulated assemblies can be machined to facilitate further mechanical
assembly operations.
PDM have worked on numerous high profile
projects to deliver encapsulation solutions for a range of industries and
applications including Marine, Oil & Gas and Defence.
Whatever the medium or method, PDM can ensure that potted assemblies are void-free
and impermeable to the surrounding environment.
Several parameters may need consideration
depending upon the circuitry involved, such as voltage ratings and dielectric
properties. For sensitive circuits stray capacitances could be induced in
the elastomer compound if not considered at the material selection
stage.
PDM have a long history of encapsulation
and moulding of acoustically transparent materials used in high-reliability
applications.